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Mechanistic contribution of electroconductive hydroxyapatite-titanium disilicide composite on the alignment and proliferation of cells

Kumar, A and Nune, KC and Basu, B and Misra, RDK (2016) Mechanistic contribution of electroconductive hydroxyapatite-titanium disilicide composite on the alignment and proliferation of cells. In: JOURNAL OF BIOMATERIALS APPLICATIONS, 30 (10). pp. 1505-1516.

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Official URL: http://dx.doi.org/10.1177/0885328216631670

Abstract

We elucidate here the mechanistic contribution of a novel electroconductive hydroxyapatite-20wt.% titanium disilicide (HA-TiSi2) composite system in favorably modulating osteoblast functions in relation to the monolithic HA. The higher electrical conductivity of HA-TiSi2 (sigma(DC)approximate to 67.117 +/- 3.57S/m) in comparison to glass sample effectively guided the electroactive myoblast, leading to their significant alignment and proliferation. This favorable behavior is attributed to the formation of small electrochemical cells between HA and TiSi2 phase, which produce a small electric field, directing the electroactive myoblast to migrate and grow in a particular direction. In contrast, no impact of TiSi2 on osteoblast function was observed because of their inability to respond to small electric field. However, the invitro bioactivity in simulated body fluid indicated the nucleation and growth of apatite crystals. Moreover, in the context of load-bearing capability, the presence of 20wt.% TiSi2 in HA led to increase in the fracture toughness by approximate to 100%. This study underscores the effectiveness of HA-TiSi2 in favorably modulating the cellular activity, myoblast in particular.

Item Type: Journal Article
Additional Information: Copy right for this article belongs to the SAGE PUBLICATIONS LTD, 1 OLIVERS YARD, 55 CITY ROAD, LONDON EC1Y 1SP, ENGLAND
Keywords: Electroconductive; electrical field; hydroxyapatite; titanium disilicide; bone tissue engineering
Department/Centre: Division of Chemical Sciences > Materials Research Centre
Depositing User: Id for Latest eprints
Date Deposited: 23 May 2016 07:26
Last Modified: 23 May 2016 07:26
URI: http://eprints.iisc.ac.in/id/eprint/53859

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