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Effect of Micro-Structured Copper as Cathode Material for P3HT-Based Diode

Kesavan, Arul Varman and Ramamurthy, Praveen C (2015) Effect of Micro-Structured Copper as Cathode Material for P3HT-Based Diode. In: IEEE TRANSACTIONS ON NANOTECHNOLOGY , MAR 2015, pp. 218-223.

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Official URL: http://dx.doi.org/10.1109/TNANO.2014.2380431

Abstract

Here, the effect of micro-structured cathode material on the device performance of indium tin oxide/poly(3hexylethiophene)/copper diode (ITO/P3HT/Cu) is investigated. Two different forms of copper namely bulk metal (Cu{B}) and nanoparticle (Cu{N}) were used as top electrode to probe its effect on device performance. Crystallographic structure and nanoscale morphology of top Cu electrodes were characterized using X-ray diffraction and scanning electronmicroscopy. Electrode formed by evaporation of copper nanoparticle showed enhancement in current density. From capacitance based spectroscopy we observed that density of trap states in ITO/P3HT/copper larger size grain (Cu-LG) are one order greater than that in ITO/P3HT/copper smaller size grain (Cu-SG) device.

Item Type: Conference Proceedings
Additional Information: Copy right for this article belongs to the IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, NJ 08855-4141 USA
Keywords: Copper electrode; current density; electronic properties; interface; metal nanoparticle; organic Schottky barrier device
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Depositing User: Id for Latest eprints
Date Deposited: 24 Apr 2015 05:52
Last Modified: 24 Apr 2015 05:52
URI: http://eprints.iisc.ac.in/id/eprint/51381

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