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Water Vapor Barrier Material by Covalent Self-Assembly for Organic Device Encapsulation

Kopanati, Gayathri N and Seethamraju, Sindhu and Ramamurthy, Praveen C and Madras, Giridhar (2014) Water Vapor Barrier Material by Covalent Self-Assembly for Organic Device Encapsulation. In: INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 53 (46). pp. 17894-17900.

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Official URL: http://dx.doi.org/ 10.1021/ie5036995

Abstract

Development of barrier materials for organic device encapsulation is of key interest for the commercialization of organic electronics. In this work, we have fabricated barrier films with ultralow water vapor permeabilities by reactive layer-by-layer approach. Using this technique, alternative layers of polyethylene imine and stearic acid were covalently bonded on a Surlyn film. The roughness, transparency and thickness of the films were determined by atomic force microscopy, UV-visible spectroscopy and scanning electron microscopy, respectively. Water vapor transmission rates through these films and the ability of these films to protect the organic photovoltaic devices was investigated. The films with covalently assembled bilayers exhibited lower water vapor transmission rates and maintained higher organic photovoltaic device efficiencies compared to the neat Surlyn film.

Item Type: Journal Article
Additional Information: Copyright for this article belongs to the AMER CHEMICAL SOC, 1155 16TH ST, NW, WASHINGTON, DC 20036 USA
Department/Centre: Division of Mechanical Sciences > Chemical Engineering
Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Division of Interdisciplinary Research > Centre for Nano Science and Engineering
Depositing User: Id for Latest eprints
Date Deposited: 12 Jan 2015 05:23
Last Modified: 12 Jan 2015 05:23
URI: http://eprints.iisc.ac.in/id/eprint/50576

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