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Modelling of transient heat conduction with diffuse interface methods

Ettrich, J and Choudhury, A and Tschukin, O and Schoof, E and August, A and Nestler, B (2014) Modelling of transient heat conduction with diffuse interface methods. In: MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 22 (8).

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Official URL: http://dx.doi.org/ 10.1088/0965-0393/22/8/085006

Abstract

We present a survey on different numerical interpolation schemes used for two-phase transient heat conduction problems in the context of interface capturing phase-field methods. Examples are general transport problems in the context of diffuse interface methods with a non-equal heat conductivity in normal and tangential directions to the interface. We extend the tonsorial approach recently published by Nicoli M et al (2011 Phys. Rev. E 84 1-6) to the general three-dimensional (3D) transient evolution equations. Validations for one-dimensional, two-dimensional and 3D transient test cases are provided, and the results are in good agreement with analytical and numerical reference solutions.

Item Type: Journal Article
Additional Information: Copyright for this article belongs to the IOP PUBLISHING LTD, TEMPLE CIRCUS, TEMPLE WAY, BRISTOL BS1 6BE, ENGLAND
Keywords: phase-field; diffuse-interface; heat-conduction; tensorial mobility; diffusion
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Depositing User: Id for Latest eprints
Date Deposited: 26 Dec 2014 06:45
Last Modified: 26 Dec 2014 06:45
URI: http://eprints.iisc.ac.in/id/eprint/50513

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