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A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks

Huang, Z and Kumar, P and Dutta, I and Pang, JHL and Sidhu, R (2014) A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks. In: ENGINEERING FRACTURE MECHANICS, 131 . pp. 9-25.

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Official URL: http://dx.doi.org/ 10.1016/j.engfracmech.2014.10.0...

Abstract

Solder joints in electronic packages undergo thermo-mechanical cycling, resulting in nucleation of micro-cracks, especially at the solder/bond-pad interface, which may lead to fracture of the joints. The fracture toughness of a solder joint depends on material properties, process conditions and service history, as well as strain rate and mode-mixity. This paper reports on a methodology for determining the mixed-mode fracture toughness of solder joints with an interfacial starter-crack, using a modified compact mixed mode (CMM) specimen containing an adhesive joint. Expressions for stress intensity factor (K) and strain energy release rate (G) are developed, using a combination of experiments and finite element (FE) analysis. In this methodology, crack length dependent geometry factors to convert for the modified CMM sample are first obtained via the crack-tip opening displacement (CTOD)-based linear extrapolation method to calculate the under far-field mode I and II conditions (f(1a) and f(2a)), (ii) generation of a master-plot to determine a(c), and (iii) computation of K and G to analyze the fracture behavior of joints. The developed methodology was verified using J-integral calculations, and was also used to calculate experimental fracture toughness values of a few lead-free solder-Cu joints. (C) 2014 Elsevier Ltd. All rights reserved.

Item Type: Journal Article
Additional Information: Copyright for this article belongs to the PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, ENGLAND
Keywords: Joint fracture; Interfacial crack; Mixed-mode fracture
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Depositing User: Id for Latest eprints
Date Deposited: 20 Dec 2014 04:23
Last Modified: 20 Dec 2014 04:23
URI: http://eprints.iisc.ac.in/id/eprint/50473

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