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Mechanical and thermal modeling of In-Cu composites for thermal interface materials applications

Kumar, Praveen and Awasthi, Sandeep (2014) Mechanical and thermal modeling of In-Cu composites for thermal interface materials applications. In: JOURNAL OF COMPOSITE MATERIALS, 48 (11). pp. 1391-1398.

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Official URL: http://dx.doi.org/10.1177/0021998313486502

Abstract

In-Cu composite solders have been proposed as an effective thermal interface material. Here, finite element analysis and theoretical treatment of their mechanical and thermal behavior is presented. It was determined that the stresses and the strains were concentrated in the narrow and wider In channels, respectively. Furthermore, it is suggested that an In-Cu composite with disk-shaped Cu inclusions may not only further improve the thermal conductivity but may also reduce the stiffness of In-Cu composites in shear.

Item Type: Journal Article
Additional Information: copyright for this article belongs to SAGE PUBLICATIONS LTD, 1 OLIVERS YARD, 55 CITY ROAD, LONDON EC1Y 1SP, ENGLAND
Keywords: Thermal interface material; finite element modeling; In-Cu composites
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Depositing User: Id for Latest eprints
Date Deposited: 09 Jun 2014 09:32
Last Modified: 13 Jun 2014 12:22
URI: http://eprints.iisc.ac.in/id/eprint/49224

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