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Recrystallization and Ag3Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys

Sahaym, Uttara and Talebanpour, Babak and Seekins, Sean and Dutta, Indranath and Kumar, Praveen and Borgesen, Peter (2013) Recrystallization and Ag3Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys. In: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 3 (11). pp. 1868-1875.

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Official URL: http://dx.doi.org/10.1109/TCPMT.2013.2272543


Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening during storage or service. This results in evolution of joint properties over time and thereby influences the long-term reliability of microelectronic packages. Accurate reliability prediction of SAC solders requires prediction of microstructural evolution during service. Microstructure evolution in two SAC solder alloys, such as, Sn-3.0Ag-0.5Cu (SAC 305) and Sn-1.0Ag-0.5 Cu (SAC 105), under different thermomechanical excursions, including isothermal aging at 150 degrees C and thermomechanical cycling (TMC) was studied. In general, between 200 and 600 cycles during TMC, recrystallization of the Sn matrix was observed, along with redistribution of Ag3Sn particles because of dissolution and reprecipitation. These latter effects have not been reported before. It was also observed that the Sn grains recrystallized near precipitate clusters in eutectic channels during extended isothermal aging. The relative orientation of Sn grains in proeutectic colonies did not change during isothermal aging.

Item Type: Journal Article
Additional Information: Copyright for this article belongs to IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC,USA
Keywords: Electron backscatter diffraction (EBSD); leadfree solders; recrystallization
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Depositing User: Id for Latest eprints
Date Deposited: 23 Jan 2014 05:42
Last Modified: 23 Jan 2014 05:42
URI: http://eprints.iisc.ac.in/id/eprint/48224

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