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Thermal Management of Electronics Using PCM-Based Heat Sink Subjected to Cyclic Heat Load

Saha, Sandip Kumar and Dutta, Pradip (2012) Thermal Management of Electronics Using PCM-Based Heat Sink Subjected to Cyclic Heat Load. In: IEEE Transactions on Components, Packaging, and Manufacturing Technology Part C, 2 (3). pp. 464-473.

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Designing a heat sink based on a phase change material (PCM) under cyclic loading is a critical issue. For cyclic operation, it is required that the fraction of the PCM melting during the heating cycle should completely resolidify during the cooling period, so that that thermal storage unit can be operated for an unlimited number of cycles. Accordingly, studies are carried out to find the parameters influencing the behavior of a PCM under cyclic loading. A number of parameters are identified in the process, the most important ones being the duty cycle and heat transfer coefficient (h) for cooling. The required h or the required cooling period for complete resolidification for infinite cyclic operation of a conventional PCM-based heat sink is found to be very high and unrealistic with air cooling from the surface. To overcome this problem, the conventional design is modified where h and the area exposed to heat transfer can be independently controlled. With this arrangement, the enhanced area provided for cooling keeps h within realistic limits. Analytical investigation is carried out to evaluate the thermal performance of this modified PCM-based heat sink in comparison to those with conventional designs. Experiments are also performed on both the conventional and the modified PCM-based heat sinks to validate the new findings.

Item Type: Journal Article
Additional Information: Copyright 2012 IEEE. Personal use of this material is permitted.However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Keywords: Cyclic loading;electronics cooling;heat sink;phase change material
Department/Centre: Division of Mechanical Sciences > Mechanical Engineering
Depositing User: Id for Latest eprints
Date Deposited: 10 Apr 2012 08:24
Last Modified: 10 Apr 2012 08:24
URI: http://eprints.iisc.ac.in/id/eprint/44163

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