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Heat transfer correlations for PCM-based heat sinks with plate fins

Saha, SK and Dutta, P (2010) Heat transfer correlations for PCM-based heat sinks with plate fins. In: 12th Conference on Process Integration, Modelling and Optimisation for Energy Saving and Pollution Reduction, MAY 10-13, 2009 , Rome, pp. 2485-2491.

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Official URL: http://dx.doi.org/10.1016/j.applthermaleng.2010.06...

Abstract

Characterization of melting process in a Phase Change Material (PCM)-based heat sink with plate fin type thermal conductivity enhancers (TCEs) is numerically studied in this paper. Detailed parametric investigations are performed to find the effect of aspect ratio of enclosure and the applied heat flux on the thermal performance of the heat sinks. Various non-dimensional numbers, such as Nusselt number (Nu), Rayleigh number (Ra), Stefan number (Ste) and Fourier number (Fo) based on a characteristic length scale, are identified as important parameters. The half fin thickness and the fin height are varied to obtain a wide range of aspect ratios of an enclosure. It is found that a single correlation of Nu with Ra is not applicable for all aspect ratios of enclosure with melt convection taken into account. To find appropriate length scales, enclosures with different aspect ratios are divided into three categories, viz. (a) shallow enclosure, (b) rectangular enclosure and (c) tall enclosure. Accordingly, an appropriate characteristic length scale is identified for each type of enclosure and correlation of Nu with Ra based on that characteristic length scale is developed. (C) 2010 Elsevier Ltd. All rights reserved.

Item Type: Conference Paper
Publication: APPLIED THERMAL ENGINEERING
Publisher: Elsevier Science
Additional Information: Copyright of this article belongs to Elsevier Science.
Keywords: Electronics cooling; Phase change materials; Constant heat flux; Correlation; Melting.
Department/Centre: Division of Mechanical Sciences > Mechanical Engineering
Date Deposited: 26 Oct 2010 07:19
Last Modified: 26 Oct 2010 07:19
URI: http://eprints.iisc.ac.in/id/eprint/33456

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