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Wrought aluminum-nickel alloys for high strength-high conductivity applications

Rohatgi, PK and Prabhakar, KV (1975) Wrought aluminum-nickel alloys for high strength-high conductivity applications. In: Metallurgical Transactions, 6 (4). pp. 1003-1008.

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Abstract

Aluminum-Nickel alloys ranging from 0.06 pct to 6.1 pct (by wt) Ni have been developed for high strength-high conductivity applications. These alloys were produced by solidification in a permanent mold followed by homogenization, hot extrusion or hot rolling and cold drawing to wire form. This sequence of fabrication a) led to the production of fine fibrous dispersoids of NiAl3 as part of the Al-NiAl3 eutectic during the initial casting operation, b) permitted the retention of fine fibrous dispersiods of NiAl3 produced during casting without any significant coarsening during processing and c) led to uniform dispersion and general alignment of these fibrous dispersoids along a given direction in the product without any measurable fiber-matrix separation, extensive fiber-fragmentation or crack production in the matrix. These alloys can be processed to wire form as easily as aluminum and when processed by the above sequence, possess very attractive combination of high strength-high electrical conductivity. Tensile strengths range from 173 N/mm2 (at 0.6 pct Ni) to 241 N/mm2 (at 6.1 pct Ni) in combination with corresponding conductivity values between 62 pct IACS and 55.5 pct IACS. The wires also possess attractive yield strength; for instance, the 0.2 pct off-set strength of Al-6.1 pct Ni wire is 213 N/mm2. Using simple composite rules, the estimated strength and the conductivity of NiAl3 fibers were found to be 1380 N/mm2 and 18 pct IACS respectively, in these wires.

Item Type: Journal Article
Additional Information: Copyright of this article belongs to Metallurgical soc amer inst.
Department/Centre: Division of Mechanical Sciences > Mechanical Engineering
Depositing User: K.S. Satyashree
Date Deposited: 23 Jan 2010 03:46
Last Modified: 19 Sep 2010 05:49
URI: http://eprints.iisc.ac.in/id/eprint/24137

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