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Comments on "Room temperature interfacial reactions in electrodeposited Au/Sn couples"

Paul, A (2009) Comments on "Room temperature interfacial reactions in electrodeposited Au/Sn couples". In: Scripta Materialia, 61 (6). pp. 561-563.

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Abstract

Recently, Tang et al. (Acta Mater. 56 (2008) 5818) published a paper explaining room temperature growth of the phases in the Au/Sn system. In their analysis, they considered Au as the only mobile species for all the product phases, and Sn as virtually immobile. It is shown here that this analysis is not correct, since Sn has a higher diffusion rate through the AuSn4 phase. On the other hand, the mobilities of species in the AuSn2 phase are as yet unknown.

Item Type: Journal Article
Additional Information: Copyright of this article belongs to Elsevier Science.
Keywords: Interdiffusion;Mobilities;Intermetallic;Point defects.
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Depositing User: Id for Latest eprints
Date Deposited: 21 Aug 2009 08:17
Last Modified: 19 Sep 2010 05:41
URI: http://eprints.iisc.ac.in/id/eprint/22254

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