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Numerical prediction of load-displacement behaviors of adhesively bonded joints at different extension rates and temperatures

Malvade, I and Deb, A and Biswas, P and Kumar, A (2009) Numerical prediction of load-displacement behaviors of adhesively bonded joints at different extension rates and temperatures. In: Computational Materials Science, 44 (4). pp. 1208-1217.

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Abstract

The present work focuses on simulation of nonlinear mechanical behaviors of adhesively bonded DLS (double lap shear) joints for variable extension rates and temperatures using the implicit ABAQUS solver. Load-displacement curves of DLS joints at nine combinations of extension rates and environmental temperatures are initially obtained by conducting tensile tests in a UTM. The joint specimens are made from dual phase (DP) steel coupons bonded with a rubber-toughened adhesive. It is shown that the shell-solid model of a DLS joint, in which substrates are modeled with shell elements and adhesive with solid elements, can effectively predict the mechanical behavior of the joint. Exponent Drucker-Prager or Von Mises yield criterion together with nonlinear isotropic hardening is used for the simulation of DLS joint tests. It has been found that at a low temperature (-20 degrees C), both Von Mises and exponent Drucker-Prager criteria give close prediction of experimental load-extension curves. However. at a high temperature (82 degrees C), Von Mises condition tends to yield a perceptibly softer joint behavior, while the corresponding response obtained using exponent Drucker-Prager criterion is much closer to the experimental load-displacement curve.

Item Type: Journal Article
Additional Information: Copyright of this article belongs to Elsevier Science.
Keywords: Double lap shear (DLS) joint;Dual phase steel substrate;Epoxy adhesive;Finite element modeling;Temperature;Strain rate
Department/Centre: Division of Mechanical Sciences > Centre for Product Design & Manufacturing
Depositing User: Rajalaxmi Ashok Govanakoppa
Date Deposited: 13 Nov 2009 08:17
Last Modified: 19 Sep 2010 05:29
URI: http://eprints.iisc.ac.in/id/eprint/19578

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